ACS714
Automotive Grade, Fully Integrated, Hall Effect-Based Linear Current Sensor IC
with 2.1 kVRMS Voltage Isolation and a Low-Resistance Current Conductor
COMMON OPERATING CHARACTERISTICS 1 over full range of T A , C F = 1 nF, and V CC = 5 V, unless otherwise specified
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
ELECTRICAL CHARACTERISTICS
Supply Voltage
V CC
4.5
5.0
5.5
V
Supply Current
Output Capacitance Load
Output Resistive Load
Primary Conductor Resistance
Rise Time
Frequency Bandwidth
Nonlinearity
Symmetry
Zero Current Output Voltage
Power-On Time
Magnetic Coupling 2
I CC
C LOAD
R LOAD
R PRIMARY
t r
f
E LIN
E SYM
V IOUT(Q)
t PO
V CC = 5.0 V, output open
VIOUT to GND
VIOUT to GND
T A = 25°C
I P = I P (max), T A = 25°C, C OUT = open
–3 dB, T A = 25°C; I P is 10 A peak-to-peak
Over full range of I P
Over full range of I P
Bidirectional; I P = 0 A, T A = 25°C
Output reaches 90% of steady-state level, T J = 25°C, 20 A present
on leadframe
4.7
98
10
1.2
3.5
80
1.5
100
V CC ×
0.5
35
12
13
10
102
mA
nF
k Ω
m Ω
μ s
kHz
%
%
V
μ s
G/A
Internal Filter Resistance 3
R F(INT)
1.7
k Ω
1 Device may be operated at higher primary current levels, I P , and ambient, T A , and internal leadframe temperatures, T A , provided that the Maximum
Junction Temperature, T J (max), is not exceeded.
2 1G = 0.1 mT.
3 R
F(INT) forms an RC circuit via the FILTER pin.
COMMON THERMAL CHARACTERISTICS 1
Min.
Typ.
Max.
Units
Operating Internal Leadframe Temperature
T A
E range
L range
–40
–40
85
150
°C
°C
Value
Units
Junction-to-Lead Thermal Resistance 2
Junction-to-Ambient Thermal Resistance
R θ JL
R θ JA
Mounted on the Allegro ASEK 714 evaluation board
Mounted on the Allegro 85-0322 evaluation board, includes the power con-
sumed by the board
5
23
°C/W
°C/W
1 Additional
thermal information is available on the Allegro website.
2 The Allegro
evaluation board has 1500 mm 2 of 2 oz. copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with thermal vias connect-
ing the layers. Performance values include the power consumed by the PCB. Further details on the board are available from the Frequently Asked
Questions document on our website. Further information about board design and thermal performance also can be found in the Applications Informa-
tion section of this datasheet.
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
4
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